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Global and China Advanced Packaging Industry Report, 2009-2010

2010-09-25                  來源:博思數據研究中心              
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導讀: 【Table of Contents】 1 Status Quo and Future of IC Advanced Packaging 1.1 Profile of IC Packaging 1.2 Types of IC Packaging 1.2.1 SOP 1.2.

【Table of Contents】

1 Status Quo and Future of IC Advanced Packaging
1.1 Profile of IC Packaging
1.2 Types of IC Packaging
1.2.1 SOP
1.2.1 QFP & LQFP
1.2.3 FBGA
1.2.4 TEBGA
1.2.5 FC-BGA
1.2.6 WLCSP
1.2.7 WLCSP Application
1.2.8 Fan-out WLCSP

2 Global & China Semiconductor Industry
2.1 Overview
2.2 Regional Distribution of Global Semiconductor
2.3 Wafer Foundry
2.4 Chinese Semiconductor Market
2.5 Chinese Semiconductor Industry

3 Status Quo and Future of Packaging & Test Industry
3.1 Status Quo
3.2 Future of Copper Wire Bonding
3.3 Horizontal Comparison
3.4 Industry Pattern of Advanced Packaging

4 Downstream Market of Advanced Packaging
4.1 Mobile Phone IC Advanced Packaging Market
4.2 Mobile Phone Baseband Packaging
4.3 Mobile Phone Application Processor Packaging
4.4 Mobile Phone Memory Packaging
4.5 Mobile Phone Transceiver Packaging
4.6 Mobile Phone PA Packaging
4.7 Mobile Phone MEMS and Other Components
4.8 Advanced Packaging of Memory Field
4.9 CPU, GPU and CHIPSET Packaging
4.10 CMOS Image Sensor Packaging
4.11 LCD Driver IC Packaging & Test

5 Advanced Packaging Enterprises
5.1 Greatek Electronics
5.2 Formosa Advanced Technologies Co.,

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